15 Sep 2010
1. STATS ChipPAC Ltd. (STATS ChipPAC), one of the world’s largest players in the Outsourced Semiconductor Assembly and Test (OSAT) services industry with over 16 years presence in Singapore, has established the world’s first 300mm high volume manufacturing operations for embedded Wafer-Level Ball Grid Array (eWLB) technology in its Yishun facility in Singapore. By establishing the world’s first 300mm eWLB manufacturing in Singapore, STATS ChipPAC demonstrates its continued commitment to embrace productivity and innovation to enhance the global competitiveness of its Singapore operations. Today, STATS ChipPAC celebrates its recent achievements in 300mm eWLB manufacturing with an official grand opening graced by National Trades Union Congress (NTUC) Secretary-General and Minister from the Prime Minister’s Office, Mr Lim Swee Say.
2 eWLB is an innovative technology that offers a high performance, power efficient semiconductor solution for the wireless and consumer markets to meet the growing demand for increased functionality, smaller size and lower cost in mobile and other electronic applications. STATS ChipPAC is the first semiconductor company in the world to introduce 300mm eWLB manufacturing capabilities. It has established a global leadership position in eWLB manufacturing by ramping to high volume production ahead of other semiconductor companies. STATS ChipPAC has invested more than $140 million (US$100 million) in eWLB manufacturing technology in Singapore since 2009.
3 In line with the NTUC Cheaper, Better, Faster strategy, STATS ChipPAC is committed to leverage on technology and innovation to improve the productivity of its workers and enhance its global competitiveness. STATS ChipPAC has been working closely with the United Workers of Electronic & Electrical Industries (UWEEI) and the Singapore Workforce Development Agency (WDA) in Singapore on skills upgrading, training and productivity collaborations. These collaborations have enabled STATS ChipPAC to build an adaptable and proficient workforce to meet the challenges of working with new and advanced semiconductor manufacturing equipment in the 300mm eWLB manufacturing operations. STATS ChipPAC has extended its 100% Proficiency® training system to its eWLB manufacturing program to ensure that workers are skilled and proficient and also to promote the growth of individuals to a higher job skill level.
4 The Company plans to increase headcount to approximately 300 employees by the end of 2010 to supports its expected growth in the new 300mm eWLB manufacturing operation. STATS ChipPAC also expects to double its eWLB workforce within two years depending on business demand. Its workforce will be trained and will have the opportunity to learn new skills in advanced wafer level packaging technology that is currently only available in Singapore.
5 STATS ChipPAC’s robust, automated eWLB manufacturing process has proved to be a solid foundation on which the company has rapidly ramped production volumes. With the large 300mm wafer manufacturing format, STATS ChipPAC’s production volume and value add per worker are expected to more than double as compared to previous manufacturing with 200mm wafer due to higher efficiency and economy of scale when manufacturing with the larger 300mm wafer format.
6 “Singapore continues to play an important role in the semiconductor industry, from research and development activities to high-tech manufacturing of leading edge technology such as eWLB. STATS ChipPAC has demonstrated that the CBF strategy can help increase their productivity and manufacturing output and employees can look forward to contributing with higher output and growing with the Company”, said Madam Halimah Yacob, Deputy Secretary-General of NTUC, and Executive Secretary of UWEEI.
7 “Innovation in manufacturing and technology are important to our success in offering customers cost effective advanced technology. We are proud of our achievements in eWLB and believe our leadership in eWLB manufacturing differentiates us from all other companies in the semiconductor industry today. We appreciate the support we have received from NTUC and the strong commitment of our employees, suppliers and customers,” said Tan Lay Koon, President and CEO, STATS ChipPAC.
